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1. 
Cover image for Nano- and microtechnology from A-Z : from nanosystems to colloids and interfaces
Nano- and microtechnology from A-Z : from nanosystems to colloids and interfaces
Author 
Schramm, Laurier Lincoln, author.
Preferred Shelf Number 
ONLINE(342195.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
John Wiley http://dx.doi.org/10.1002/9783527337316
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2. 
Cover image for Surface Tension in Microsystems Engineering Below the Capillary Length
Surface Tension in Microsystems Engineering Below the Capillary Length
Author 
Lambert, Pierre. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334451.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-37552-1
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3. 
Cover image for Design and Manufacturing of Active Microsystems
Design and Manufacturing of Active Microsystems
Author 
Büttgenbach, Stephanus. editor. Burisch, Arne. editor. Hesselbach, Jürgen. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-12903-2
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4. 
Cover image for Thermal Transport for Applications in Micro/Nanomachining
Thermal Transport for Applications in Micro/Nanomachining
Author 
Wong, Basil T. author. Mengüç, M. Pinar. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-73607-3
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5. 
Cover image for Capillary Forces in Microassembly Modeling, Simulation, Experiments, and Case Study
Capillary Forces in Microassembly Modeling, Simulation, Experiments, and Case Study
Author 
Lambert, Pierre. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-71089-1
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6. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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7. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138987
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8. 
Cover image for Micro and Nanomanufacturing Volume II
Micro and Nanomanufacturing Volume II
Author 
Jackson, Mark J. editor. (orcid)0000-0001-9087-3515 Ahmed, Waqar. editor. (orcid)0000-0003-4152-5172 SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-70499-4
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9. 
Cover image for Emerging Technologies with Advanced Devices from Micro to Nano ETMN 2024
Emerging Technologies with Advanced Devices from Micro to Nano ETMN 2024
Author 
Mukhopadhyay, Subhas Chandra. editor. Islam, Tarikul. editor. Khan, Shakeb A. editor. Mehfuz, Shabana. editor. Khan, Mohammad Ajmal. editor.
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-84331-0
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10. 
Cover image for Microactuators, Microsensors and Micromechanisms MAMM 2024
Microactuators, Microsensors and Micromechanisms MAMM 2024
Author 
Nguyen, Duc-Nam. editor. Tran, Ngoc Dang Khoa. editor. (orcid)0000-0002-5779-2016 Huynh, Van Tuan. editor. Ono, Takahito. editor. Nguyen, Van Hieu. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-83357-1
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11. 
Cover image for A fresh concept of software-resemblant hardware to leap to 6G and future networks : micro/nanotechnologies as enablers of pervasivity
A fresh concept of software-resemblant hardware to leap to 6G and future networks : micro/nanotechnologies as enablers of pervasivity
Author 
Iannacci, Jacopo, author.
Preferred Shelf Number 
TK5103.252
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003494928
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
Author 
Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62546-6
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