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Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for The Electrical Engineering Handbook - Six Volume Set
The Electrical Engineering Handbook - Six Volume Set
Author 
Dorf, Richard C., editor. Taylor and Francis.
Preferred Shelf Number 
R857 .B54
Electronic Access 
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3. 
Cover image for Nanoscience Advances in CBRN Agents Detection, Information and Energy Security
Nanoscience Advances in CBRN Agents Detection, Information and Energy Security
Author 
Petkov, Plamen. editor. Tsiulyanu, Dumitru. editor. Kulisch, Wilhelm. editor. Popov, Cyril. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-94-017-9697-2
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4. 
Cover image for Commercializing micro-nanotechnology products
Commercializing micro-nanotechnology products
Author 
Tolfree, David, 1938- Jackson, Mark J.
Preferred Shelf Number 
T174.7 .C66 2008
Electronic Access 
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