Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
15 Results Found Subscribe to search results
000000000000DEFAULT
Print
1. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-78219-5
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Nanotechnology for sustainable food packaging
Nanotechnology for sustainable food packaging
Author 
Anandharamakrishnan, C., editor. Moses, Jeyan A., editor. Leena, Maria, editor.
Preferred Shelf Number 
TP374 .N39 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119875154
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Nanotechnology in intelligent food packaging
Nanotechnology in intelligent food packaging
Author 
Annu, editor. Bhattacharya, Tanima, editor. Ahmed, Shakeel, editor.
Preferred Shelf Number 
TP374 .N36 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119819011
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Nanopackaging Nanotechnologies and Electronics Packaging
Nanopackaging Nanotechnologies and Electronics Packaging
Author 
Morris, James E. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47325-3
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Nanotechnology horizons in food process engineering, Volume 1 : Food preservation, food packaging and sustainable agriculture
Nanotechnology horizons in food process engineering, Volume 1 : Food preservation, food packaging and sustainable agriculture
Author 
Goyal, Megh R., editor. Malik, Junaid Ahmad, 1987- editor. Kumar, Satish (Lecturer in food science and technology), editor. Watharkar, Ritesh B., editor.
Preferred Shelf Number 
TP248.65 .F66
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003305378
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for Nano-innovations in food packaging : functions and applications
Nano-innovations in food packaging : functions and applications
Author 
Mathew, Shiji, editor. Radhakrishnan, E. K. (Edayileveettil Krishnankutty), editor.
Preferred Shelf Number 
TP374
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003277422
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Nanotechnology Interventions in Food Packaging and Shelf Life.
Nanotechnology Interventions in Food Packaging and Shelf Life.
Author 
Dar, Aamir Hussain, editor. Nayik, Gulzar Ahmad, editor.
Preferred Shelf Number 
TP374
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003207641
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
Format: 
Availability 
Online Library~1
Available:
Copies:
11. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28522-6
Format: 
Availability 
Online Library~1
Available:
Copies:
12. 
Cover image for Nanotechnology in functional foods
Nanotechnology in functional foods
Author 
Bhattacharya, Tanima, editor. Ahmed, Shakeel, editor.
Preferred Shelf Number 
QP144 .F85 N36 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119905059
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets