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1. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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2. 
Cover image for Introduction to Advanced System-on-Chip Test Design and Optimization
Introduction to Advanced System-on-Chip Test Design and Optimization
Author 
Larsson, Erik. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b135763
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3. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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4. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2751-7
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