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1. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-12862-7
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2. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-40170-1
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3. 
Cover image for Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Author 
Fan, Jiyang. author. Chu, Paul K. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-08726-9
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4. 
Cover image for Optical materials and applications
Optical materials and applications
Author 
Wakaki, Moriaki.
Preferred Shelf Number 
QC374 .O668 2013
Electronic Access 
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