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1. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-33913-2
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2. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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3. 
Cover image for Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Author 
Fulde, Michael. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-3280-5
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4. 
Cover image for Planar Double-Gate Transistor From Technology to Circuit
Planar Double-Gate Transistor From Technology to Circuit
Author 
Amara, Amara. editor. Rozeau, Olivier. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9341-8
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5. 
Cover image for ESD Protection Device and Circuit Design for Advanced CMOS Technologies
ESD Protection Device and Circuit Design for Advanced CMOS Technologies
Author 
Semenov, Oleg. author. Sarbishaei, Hossein. author. Sachdev, Manoj. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-8301-3
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6. 
Cover image for Organic Solar Cells Theory, Experiment, and Device Simulation
Organic Solar Cells Theory, Experiment, and Device Simulation
Author 
Tress, Wolfgang. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-10097-5
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