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1. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
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2. 
Cover image for Symmetry Properties in Transmission Lines Loaded with Electrically Small Resonators Circuit Modeling and Applications
Symmetry Properties in Transmission Lines Loaded with Electrically Small Resonators Circuit Modeling and Applications
Author 
Naqui, Jordi. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-24566-9
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3. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0784-4
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4. 
Cover image for Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Author 
Fulde, Michael. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-90-481-3280-5
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5. 
Cover image for Planar Double-Gate Transistor From Technology to Circuit
Planar Double-Gate Transistor From Technology to Circuit
Author 
Amara, Amara. editor. Rozeau, Olivier. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-9341-8
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6. 
Cover image for ESD Protection Device and Circuit Design for Advanced CMOS Technologies
ESD Protection Device and Circuit Design for Advanced CMOS Technologies
Author 
Semenov, Oleg. author. Sarbishaei, Hossein. author. Sachdev, Manoj. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-8301-3
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7. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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8. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-43199-4
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9. 
Cover image for Organic Solar Cells Theory, Experiment, and Device Simulation
Organic Solar Cells Theory, Experiment, and Device Simulation
Author 
Tress, Wolfgang. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-10097-5
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