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Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
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2. 
Cover image for Electronic and photonic circuits and devices
Electronic and photonic circuits and devices
Author 
Waynant, Ronald W. Lowell, John. IEEE Circuits and Systems Society. Components, Packaging & Manufacturing Technology Society.
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ONLINE
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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558
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3. 
Cover image for Optoelectronics : infrared-visible-ultraviolet devices and applications
Optoelectronics : infrared-visible-ultraviolet devices and applications
Author 
Birtalan, Dave. Nunley, William, 1928-
Preferred Shelf Number 
TA1750 .O68 2009
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