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Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-96-4166-6
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2. 
Cover image for Proceedings of the 4th Annual International Conference on Material, Machines, and Methods for Sustainable Development (MMMS2024) Volume 3: Sustainable Approaches in Machine Design, Life Cycle Engineering, and Energy Management for Manufacturing Processes
Proceedings of the 4th Annual International Conference on Material, Machines, and Methods for Sustainable Development (MMMS2024) Volume 3: Sustainable Approaches in Machine Design, Life Cycle Engineering, and Energy Management for Manufacturing Processes
Author 
Long, Banh Tien. editor. Nang, Ho Xuan. editor. Huy, Pham Thanh. editor. Kim, Yun-Hae. editor. Ishizaki, Kozo. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-96126-7
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3. 
Cover image for Advances in Thermal Engineering Select Proceedings of ICFAMMT 2024
Advances in Thermal Engineering Select Proceedings of ICFAMMT 2024
Author 
Choubey, Gautam. editor. Tripathi, Sumit. editor. (orcid)0000-0003-4074-3901 Singh, V. K. editor. Subbarao, P. M. V. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-4500-5
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