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Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
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Lau, John.
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Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
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Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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