Limit Search Results
Author
SpringerLink (Online service)
(6)
Brown, William D., 1943-
(2)
Greenhouse, Hal.
(2)
Ulrich, Richard K. (Richard Kevin), 1955-
(2)
Agarwal, Rakish, author.
(1)
Language
Publication Date
-
Subject
Electronic packaging.
(22)
Electronic books.
(11)
Electronics.
(8)
TECHNOLOGY & ENGINEERING.
(6)
Mise sous boîtier (Électronique)
(5)
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
51 Results Found Subscribe to search results
000000000000DEFAULT
Print
1. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-
Preferred Shelf Number 
ONLINE
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for The electronic packaging handbook
The electronic packaging handbook
Author 
Blackwell, Glenn R.
Preferred Shelf Number 
TK7870.15 .E4233 2000
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties
Author 
Pecht, Michael, author. Agarwal, Rakish, author. Dishongh, Terrance J., author. Javadpour, Sirus, author. Mahajan, Rahul, author.
Preferred Shelf Number 
TK7870.15 P434 2017
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Flexible electronic packaging and encapsulation technology
Flexible electronic packaging and encapsulation technology
Author 
Meng, Hong, editor. Huang, Wei, editor.
Preferred Shelf Number 
TK7870.15 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Electronic packaging science and technology
Electronic packaging science and technology
Author 
Tu, K. N. (King-Ning), 1937- author. Chen, Chih, 1970- author. Chen, Hung-Ming, author.
Preferred Shelf Number 
TK7870.15 .T85 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for Thermal and structural electronic packaging analysis for space and extreme environments
Thermal and structural electronic packaging analysis for space and extreme environments
Author 
Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
Online Library~1
Available:
Copies:
11. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
Format: 
Availability 
Online Library~1
Available:
Copies:
12. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28522-6
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets