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1. 
Cover image for The IoT Physical Layer Design and Implementation
The IoT Physical Layer Design and Implementation
Author 
Elfadel, Ibrahim (Abe) M. editor. Ismail, Mohammed. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-93100-5
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2. 
Cover image for Machine Learning in VLSI Computer-Aided Design
Machine Learning in VLSI Computer-Aided Design
Author 
Elfadel, Ibrahim (Abe) M. editor. Boning, Duane S. editor. Li, Xin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-04666-8
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3. 
Cover image for VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023, Revised Extended Selected Papers
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023, Revised Extended Selected Papers
Author 
Elfadel, Ibrahim (Abe) M. editor. (orcid)0000-0003-3220-9987 Albasha, Lutfi. editor. (orcid)0000-0001-5933-0280 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-70947-0
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4. 
Cover image for 3D Stacked Chips From Emerging Processes to Heterogeneous Systems
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Author 
Elfadel, Ibrahim (Abe) M. editor. (orcid)0000-0003-3220-9987 Fettweis, Gerhard. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-20481-9
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5. 
Cover image for Tapered Beams in MEMS A Symbolic Modeling Framework with Applications to Energy Harvesting
Tapered Beams in MEMS A Symbolic Modeling Framework with Applications to Energy Harvesting
Author 
Syed, Wajih U. author. Elfadel, Ibrahim (Abe) M. author. (orcid)0000-0003-3220-9987 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-66391-8
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6. 
Cover image for VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Author 
Maniatakos, Michail. editor. (orcid)0000-0001-6899-0651 Elfadel, Ibrahim (Abe) M. editor. (orcid)0000-0003-3220-9987 Sonza Reorda, Matteo. editor. (orcid)0000-0003-2899-7669 Ugurdag, H. Fatih. editor. (orcid)0000-0002-6256-0850 Monteiro, José. editor. (orcid)0000-0003-0603-2268
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https://doi.org/10.1007/978-3-030-15663-3
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