Title:
Avoiding inelastic strains in solder joint interconnections of IC devices
Author:
Suhir, Ephraim, author.
ISBN:
9780429460470
9780429863820
9780429863813
9780429863806
Edition:
First edition.
Physical Description:
1 online resource : illustrations
Electronic Access:
Taylor & Francis https://www.taylorfrancis.com/books/9780429460470OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 590345-1001 | TK7874.53 .S84 2021 EB | Searching... | Searching... |