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1. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
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Cover image for Routing in the third dimension from VLSI chips to MCMs
Routing in the third dimension from VLSI chips to MCMs
Author 
Sherwani, N. A. (Naveed A.) Bhingarde, Siddharth. Panyam, Anand.
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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263943
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