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1. 
Cover image for New Directions in Thin Film Nanophotonics
New Directions in Thin Film Nanophotonics
Author 
K. V., Sreekanth. author. ElKabbash, Mohamed. author. Caligiuri, Vincenzo. author. Singh, Ranjan. author. De Luca, Antonio. author.
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https://doi.org/10.1007/978-981-13-8891-0
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2. 
Cover image for Best Practices for the Use of Simulation in POD Curves Estimation Application to UT Weld Inspection
Best Practices for the Use of Simulation in POD Curves Estimation Application to UT Weld Inspection
Author 
Chapuis, Bastien. author. Calmon, Pierre. author. Jenson, Frédéric. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-62659-8
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3. 
Cover image for Sensors, Algorithms and Applications for Structural Health Monitoring IIW Seminar on SHM, 2015
Sensors, Algorithms and Applications for Structural Health Monitoring IIW Seminar on SHM, 2015
Author 
Chapuis, Bastien. editor. Sjerve, Eric. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-69233-3
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4. 
Cover image for Unified Strength Theory and Its Applications
Unified Strength Theory and Its Applications
Author 
Yu, Mao-Hong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6247-6
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5. 
Cover image for Magnetostatic Modelling of Thin Layers Using the Method of Moments And Its Implementation in OCTAVE/MATLAB
Magnetostatic Modelling of Thin Layers Using the Method of Moments And Its Implementation in OCTAVE/MATLAB
Author 
Szewczyk, Roman. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77985-0
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6. 
Cover image for Sustainable Innovations in Textile Chemistry and Dyes
Sustainable Innovations in Textile Chemistry and Dyes
Author 
Muthu, Subramanian Senthilkannan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8600-7
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7. 
Cover image for Advances in Materials Processing Proceedings of Chinese Materials Conference 2017
Advances in Materials Processing Proceedings of Chinese Materials Conference 2017
Author 
Han, Yafang. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-0107-0
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8. 
Cover image for Fracture Mechanics With an Introduction to Micromechanics
Fracture Mechanics With an Introduction to Micromechanics
Author 
Gross, Dietmar. author. Seelig, Thomas. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-71090-7
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9. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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10. 
Cover image for Basics of Continuum Plasticity
Basics of Continuum Plasticity
Author 
Chung, Kwansoo. author. Lee, Myoung-Gyu. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-10-8306-8
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11. 
Cover image for Contact Modeling for Solids and Particles
Contact Modeling for Solids and Particles
Author 
Popp, Alexander. editor. Wriggers, Peter. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-90155-8
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12. 
Cover image for Singular Solutions in Plasticity
Singular Solutions in Plasticity
Author 
Alexandrov, Sergei. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-5227-9
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