Switch to list view
Switch to thumbnail view
7 Results Found Subscribe to search results
0000000DEFAULT
Print
1. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
Availability 
Beytepe Library~2
Available:
Copies:
3. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-78219-5
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-88783-8
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Smart materials
Smart materials
Author 
Schwartz, Mel M.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets