Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Switch to list view
Switch to thumbnail view
7 Results Found Subscribe to search results
0000000DEFAULT
Print
1. 
Cover image for Three-dimensional integrated circuit design
Three-dimensional integrated circuit design
Author 
Pavlidis, Vasilis F., 1976- author. Savidis, Ioannis, author. Frian, Eby G., author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780124105010
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Design of 3D integrated circuits and systems
Design of 3D integrated circuits and systems
Author 
Sharma, Rohit, editor.
Preferred Shelf Number 
ONLINE(356768.1)
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Vertical 3D memory technologies
Vertical 3D memory technologies
Author 
Prince, Betty, author.
Preferred Shelf Number 
ONLINE(341730.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
John Wiley http://dx.doi.org/10.1002/9781118760475
Safari Books Online http://proquest.safaribooksonline.com/?fpi=9781118760468
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Handbook of 3D Integration : 3D process technology
Handbook of 3D Integration : 3D process technology
Author 
Garrou, Philip E., editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor.
Preferred Shelf Number 
ONLINE(342210.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527670109
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets