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1. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
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2. 
Cover image for Reliability prediction for microelectronics
Reliability prediction for microelectronics
Author 
Bernstein, Joseph B., author. Bensoussan, Alain A., author. Bender, Emmanuel (Carl), author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394210961
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3. 
Cover image for Micro-Electronics and Telecommunication Engineering Proceedings of 7th ICMETE 2023
Micro-Electronics and Telecommunication Engineering Proceedings of 7th ICMETE 2023
Author 
Sharma, Devendra Kumar. editor. Peng, Sheng-Lung. editor. (orcid)0000-0002-9484-6677 Sharma, Rohit. editor. (orcid)0000-0002-1600-5039 Jeon, Gwanggil. editor. (orcid)0000-0002-0651-4278 SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-9562-2
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4. 
Cover image for Advances in Microelectronics, Embedded Systems and IoT Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Advances in Microelectronics, Embedded Systems and IoT Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Chakravarthy, V. V. S. S. S. editor. Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Anguera, Jaume. editor. Urooj, Shabana. editor. (orcid)0000-0002-1477-8759 Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-0767-6
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5. 
Cover image for Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Author 
van Driel, Willem Dirk. editor. Pressel, Klaus. editor. Soyturk, Mujdat. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-59361-1
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6. 
Cover image for Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 Flores-Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449 Urooj, Shabana. editor. (orcid)0000-0002-1477-8759 Sankar Dhar, Rudra. editor. (orcid)0000-0002-6571-3808
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-0644-0
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7. 
Cover image for Electromagnetic wave absorbing materials : fundamentals and applications
Electromagnetic wave absorbing materials : fundamentals and applications
Author 
Wu, Hongjing (Professor), editor. Luo, Jun (Professor of microelectronics), editor. Yang, Meiyin, editor.
Preferred Shelf Number 
QC182 .W8 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119699316
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8. 
Cover image for Nanonetworks : the future of communication and computation
Nanonetworks : the future of communication and computation
Author 
Lau, Florian-Lennert A., author.
Preferred Shelf Number 
TK7874.845 .L38 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394213139
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9. 
Cover image for Polymer surface modification to enhance adhesion : techniques and applications
Polymer surface modification to enhance adhesion : techniques and applications
Author 
Netravali, Anil Narayan, 1948- editor. Mittal, K. L., 1945- editor.
Preferred Shelf Number 
QD381.9 .S97 P65 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394231034
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10. 
Cover image for Integrated devices for artificial intelligence and VLSI
Integrated devices for artificial intelligence and VLSI
Preferred Shelf Number 
Q336 .I58 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394205158
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11. 
Cover image for Formal and Practical Techniques for the Complex System Design Process using Virtual Prototypes Better Early than Never
Formal and Practical Techniques for the Complex System Design Process using Virtual Prototypes Better Early than Never
Author 
Pieper, Pascal. author. (orcid)0000-0002-7155-2537 Drechsler, Rolf. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-51692-4
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12. 
Cover image for The Proceedings of the 18th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 18th Annual Conference of China Electrotechnical Society Volume II
Author 
Yang, Qingxin. editor. Li, Zewen. editor. Luo, An. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-1428-5
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