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1. 
Cover image for Fundamentals of Electronics Circuit Analysis and Amplifier Design
Fundamentals of Electronics Circuit Analysis and Amplifier Design
Author 
Yuce, Erkan. author. Minaei, Shahram. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-032-05261-2
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2. 
Cover image for THz and Sub-THz CMOS Electronics for High-Speed Telecommunication Architectures and Circuits for Future 6G Transceivers
THz and Sub-THz CMOS Electronics for High-Speed Telecommunication Architectures and Circuits for Future 6G Transceivers
Author 
D'heer, Carl. author. Reynaert, Patrick. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-64439-9
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3. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume II
A Problem-Solving Approach to Electric Circuits Volume II
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95634-8
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4. 
Cover image for Versatile Hardware Analysis Techniques From Waveform-based Analysis to Formal Verification
Versatile Hardware Analysis Techniques From Waveform-based Analysis to Formal Verification
Author 
Klemmer, Lucas. author. Große, Daniel. author. (orcid)0000-0002-1490-6175 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-83093-8
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5. 
Cover image for Quantum Computing Architecture and Hardware for Engineers Step by Step
Quantum Computing Architecture and Hardware for Engineers Step by Step
Author 
Wong, Hiu Yung. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-78219-0
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6. 
Cover image for CMOS Plasma and Process Damage
CMOS Plasma and Process Damage
Author 
Prall, Kirk. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-89029-1
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7. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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8. 
Cover image for Safe and Sustainable Mobility by Design Safe Cities, Vehicles, Institutions, and Human Rights
Safe and Sustainable Mobility by Design Safe Cities, Vehicles, Institutions, and Human Rights
Author 
Tiwari, Geetam. editor. Varghese, Mathew. editor. Bhalla, Kavi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-2100-2
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9. 
Cover image for Reliability of CMOS Analog ICs
Reliability of CMOS Analog ICs
Author 
Kuntman, Hakan. author. Özenli, Deniz. author. (orcid)0000-0002-6381-3629 Kaçar, Fırat. author. (orcid)0000-0002-0967-914X Özçelep, Yasin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-85455-2
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10. 
Cover image for CMOS-based Portable NMR/MRI Microsystems
CMOS-based Portable NMR/MRI Microsystems
Author 
Fan, Shuhao. author. Zhou, Qi. author. (orcid)0000-0002-3949-7953 Lei, Ka-Meng. author. Martins, Rui P. author. Mak, Pui-In. author.
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https://doi.org/10.1007/978-3-031-91447-8
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11. 
Cover image for Cryogenic Microelectronic Systems for Ultra-Low Energy and Enhanced Performance
Cryogenic Microelectronic Systems for Ultra-Low Energy and Enhanced Performance
Author 
Zhuldassov, Nurzhan. author. Friedman, Eby G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-90754-8
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12. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume III
A Problem-Solving Approach to Electric Circuits Volume III
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95493-1
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