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Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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Online Library~1
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2. 
Cover image for Thermal design of electronic equipment
Thermal design of electronic equipment
Author 
Remsburg, Ralph.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
Format: 
Availability 
Online Library~1
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3. 
Cover image for Electronic techniques : shop practices and construction
Electronic techniques : shop practices and construction
Author 
Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.
Preferred Shelf Number 
TK7836 .V55 1996
Format: 
Availability 
Beytepe Library~1
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