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1. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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2. 
Cover image for Advanced techniques for maintenance modeling and reliability analysis of repairable systems
Advanced techniques for maintenance modeling and reliability analysis of repairable systems
Author 
Sharma, Garima, author. Rai, Rajiv Nandan, author.
Preferred Shelf Number 
TA169 .S53 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394174836
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3. 
Cover image for Probabilistic physics of failure approach to reliability : modeling, accelerated testing, prognosis and reliability assessment
Probabilistic physics of failure approach to reliability : modeling, accelerated testing, prognosis and reliability assessment
Author 
Modarres, M. (Mohammad), author. Amiri, Mehdi, author. Jackson, Christopher, 1979- author.
Preferred Shelf Number 
TA169.5
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119388692
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Online Library~1
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