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1. 
Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
Author 
Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0984-8
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Online Library~1
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2. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
Author 
Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331292.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1963-1
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Online Library~1
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