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1. 
Cover image for Nanoscale Photonics and Optoelectronics Science and Technology
Nanoscale Photonics and Optoelectronics Science and Technology
Author 
Wang, Zhiming M. editor. Neogi, Arup. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7587-4
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2. 
Cover image for Nanoelectronics and Photonics From Atoms to Materials, Devices, and Architectures
Nanoelectronics and Photonics From Atoms to Materials, Devices, and Architectures
Author 
Korkin, Anatoli. editor. Rosei, Federico. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-387-76499-3
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3. 
Cover image for Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2024 55th Annual Meeting of the Italian Electronics Society
Author 
Valle, Maurizio. editor. (orcid)0000-0002-7366-6060 Gastaldo, Paolo. editor. (orcid)0000-0002-5748-3942 Limiti, Ernesto. editor. (orcid)0000-0003-4668-7461 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71518-1
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4. 
Cover image for Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Author 
Kumar, Pradeep. editor. Navaraj, William. editor. Moreira, Fernando. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-96-9231-6
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5. 
Cover image for Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Author 
Pietrenko-Dabrowska, Anna. author. Koziel, Slawomir. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-43845-5
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6. 
Cover image for Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
Author 
Ciofi, Carmine. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-48711-8
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7. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
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8. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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9. 
Cover image for Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Author 
Aly, Mohamed M. Sabry. editor. Chattopadhyay, Anupam. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-16-7487-7
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10. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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11. 
Cover image for Proceedings of the Tiangong-2 Remote Sensing Application Conference Technology, Method and Application
Proceedings of the Tiangong-2 Remote Sensing Application Conference Technology, Method and Application
Author 
Gu, Yidong. editor. Gao, Ming. editor. Zhao, Guangheng. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3501-3
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12. 
Cover image for Millimeter-Wave Gyrotron Traveling-Wave Tube Amplifiers
Millimeter-Wave Gyrotron Traveling-Wave Tube Amplifiers
Author 
Du, Chao-Hai. author. Liu, Pu-Kun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-54728-7
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