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1. 
Cover image for Current Signature Analysis for Condition Monitoring of Cage Induction Motors : Industrial Application and Case Histories
Current Signature Analysis for Condition Monitoring of Cage Induction Motors : Industrial Application and Case Histories
Author 
Thomson, William T. Culbert, Ian.
Preferred Shelf Number 
TK2785
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119175476
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2. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0451-8
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3. 
Cover image for Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Intelligent Solutions for Smart Grids and Smart Cities Select Proceedings of IPECS 2022
Author 
Siano, Pierluigi. editor. Williamson, Sheldon. editor. Beevi, Sabeena. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0915-5
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4. 
Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-09853-6
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5. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-12818-9
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6. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0357-3
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7. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0408-2
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8. 
Cover image for Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
Author 
Dantsevich, Igor. editor. Samoylenko, Irina. editor. (orcid)0000-0001-6907-1403 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-20631-3
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9. 
Cover image for Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Author 
Duan, Baoyan, author. Zhang, Shuxin (Professor of electromechanical engineering), author.
Preferred Shelf Number 
TK7876 .D83 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119904427
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10. 
Cover image for Real-time embedded systems
Real-time embedded systems
Author 
Wang, Jiacun, 1963- author.
Preferred Shelf Number 
TK7895 .E42
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119420712
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11. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
Author 
Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06764-3
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12. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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