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1. 
Cover image for Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Proceedings of the NATO Advanced Research Workshop on Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Kiev, Ukraine 26–30 April 2004
Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Proceedings of the NATO Advanced Research Workshop on Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Kiev, Ukraine 26–30 April 2004
Author 
Flandre, Denis. editor. Nazarov, Alexei N. editor. Hemment, Peter L.F. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-3013-4
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2. 
Cover image for Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Author 
Joy, Soumitra R.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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3. 
Cover image for Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Author 
Li, Wei. author. Yuan, Xin'an. author. Zhao, Jianming. author. Yin, Xiaokang. author. Li, Xiao. author.
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https://doi.org/10.1007/978-981-97-7255-1
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4. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8780-7
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5. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8824-8
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6. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VI
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8828-6
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7. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-8816-3
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8. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8832-3
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9. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume IV
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume IV
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8820-0
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10. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-8812-5
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11. 
Cover image for Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Bhateja, Vikrant. editor. Chakravarthy, V. V. S. S. S. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Flores Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-8422-6
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12. 
Cover image for Circuit-Technology Co-Optimization of SRAM Design in Advanced CMOS Nodes
Circuit-Technology Co-Optimization of SRAM Design in Advanced CMOS Nodes
Author 
Liu, Hsiao-Hsuan. author. Catthoor, Francky. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
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https://doi.org/10.1007/978-3-031-76109-6
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