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1. 
Cover image for Core-Shell Nanomaterials From Fundamentals to Applications
Core-Shell Nanomaterials From Fundamentals to Applications
Author 
Sharma, Shreya. Phogat, Peeyush. Thakur, Jahanvi. Singh, N. L.
Preferred Shelf Number 
XX(600416.1)
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527855766
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2. 
Cover image for Next-generation electrochromic devices : from multifunctional materials to smart glasses
Next-generation electrochromic devices : from multifunctional materials to smart glasses
Author 
Cossari, Pierluigi, author.
Preferred Shelf Number 
TA1750 .C67 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527832583
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3. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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4. 
Cover image for Monte Carlo Methods for Partial Differential Equations With Applications to Electronic Design Automation
Monte Carlo Methods for Partial Differential Equations With Applications to Electronic Design Automation
Author 
Yu, Wenjian. author. Mascagni, Michael. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-3250-2
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5. 
Cover image for Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
Author 
Dantsevich, Igor. editor. Samoylenko, Irina. editor. (orcid)0000-0001-6907-1403 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-20631-3
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6. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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7. 
Cover image for Analog electronics for measuring systems
Analog electronics for measuring systems
Author 
Bucci, Davide, 1979- author.
Preferred Shelf Number 
TK7867
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119405177
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8. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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9. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-51697-4
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10. 
Cover image for More than Moore Technologies for Next Generation Computer Design
More than Moore Technologies for Next Generation Computer Design
Author 
Topaloglu, Rasit O. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2163-8
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11. 
Cover image for Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Author 
Maharatna, Koushik. editor. Dalapati, Goutam Kumar. editor. Banerjee, P K. editor. Mallick, Amiya Kumar. editor. Mukherjee, Moumita. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2274-3
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12. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-17924-7
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