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1. 
Cover image for Handbook of Adhesion Technology
Handbook of Adhesion Technology
Author 
da Silva, Lucas F. M. editor. Öchsner, Andreas. editor. Adams, Robert D. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-55411-2
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2. 
Cover image for The Advances in Joining Technology
The Advances in Joining Technology
Author 
Awang, Mokhtar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-9041-7
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3. 
Cover image for Turbine Blade Investment Casting Die Technology
Turbine Blade Investment Casting Die Technology
Author 
Zhang, Dinghua. author. Cheng, Yunyong. author. Jiang, Ruisong. author. Wan, Neng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-54188-3
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4. 
Cover image for Surface Finishing Theory and New Technology
Surface Finishing Theory and New Technology
Author 
Yang, Shengqiang. author. Li, Wenhui. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-662-54133-3
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5. 
Cover image for Micro-manufacturing engineering and technology
Micro-manufacturing engineering and technology
Author 
Qin, Y. (Yi)
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ScienceDirect http://www.sciencedirect.com/science/book/9780815515456
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6. 
Cover image for Vibrations in the Production System Measurement and Analysis with Water Jet Technology
Vibrations in the Production System Measurement and Analysis with Water Jet Technology
Author 
Olejárová, Štefánia. author. Ružbarský, Juraj. author. Krenický, Tibor. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-01737-8
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7. 
Cover image for Advances in Production Research Proceedings of the 8th Congress of the German Academic Association for Production Technology (WGP), Aachen, November 19-20, 2018
Advances in Production Research Proceedings of the 8th Congress of the German Academic Association for Production Technology (WGP), Aachen, November 19-20, 2018
Author 
Schmitt, Robert. editor. Schuh, Günther. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-03451-1
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8. 
Cover image for Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Author 
Ng, Leonard W. T. author. Hu, Guohua. author. Howe, Richard C. T. author. Zhu, Xiaoxi. author. Yang, Zongyin. author.
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https://doi.org/10.1007/978-3-319-91572-2
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9. 
Cover image for Advances in Manufacturing Technology Select Proceedings of ICAMT 2018
Advances in Manufacturing Technology Select Proceedings of ICAMT 2018
Author 
Hiremath, Somashekhar S. editor. Shanmugam, N. Siva. editor. Bapu, B. R. Ramesh. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-13-6374-0
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10. 
Cover image for Smart Technology Trends in Industrial and Business Management
Smart Technology Trends in Industrial and Business Management
Author 
Cagáňová, Dagmar. editor. Balog, Michal. editor. Knapčíková, Lucia. editor. Soviar, Jakub. editor. Mezarcıöz, Serkan. editor.
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Electronic Access 
https://doi.org/10.1007/978-3-319-76998-1
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11. 
Cover image for Asset Intelligence through Integration and Interoperability and Contemporary Vibration Engineering Technologies Proceedings of the 12th World Congress on Engineering Asset Management and the 13th International Conference on Vibration Engineering and Technology of Machinery
Asset Intelligence through Integration and Interoperability and Contemporary Vibration Engineering Technologies Proceedings of the 12th World Congress on Engineering Asset Management and the 13th International Conference on Vibration Engineering and Technology of Machinery
Author 
Mathew, Joseph. editor. Lim, C.W. editor. Ma, Lin. editor. Sands, Don. editor. Cholette, Michael E. editor.
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Electronic Access 
https://doi.org/10.1007/978-3-319-95711-1
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12. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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