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1. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2751-7
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2. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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3. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2047-3
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4. 
Cover image for Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Author 
Nazarov, Alexei. editor. Balestra, Francis. editor. Kilchytska, Valeriya. editor. Flandre, Denis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08804-4
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5. 
Cover image for High-Efficiency Solar Cells Physics, Materials, and Devices
High-Efficiency Solar Cells Physics, Materials, and Devices
Author 
Wang, Xiaodong. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01988-8
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6. 
Cover image for Applications of Graphene An Overview
Applications of Graphene An Overview
Author 
Wolf, E. L. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-03946-6
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