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1. 
Cover image for Gigantic challenges, nano solutions : the science and engineering of nanoscale systems
Gigantic challenges, nano solutions : the science and engineering of nanoscale systems
Author 
Amer, Maher S., author.
Preferred Shelf Number 
T174.7
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003147046
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Energy systems : a new approach to engineering thermodynamics
Energy systems : a new approach to engineering thermodynamics
Author 
Gicquel, Renaud, author.
Preferred Shelf Number 
TJ265
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003175629
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 6 Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics
Author 
Tighe, Rachael C. editor. Considine, John. editor. Kramer, Sharlotte L.B. editor. Berfield, Tom. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-17475-9
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4. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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5. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2581-0
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6. 
Cover image for Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
Power generation handbook fundamentals of low-emission, high-efficiency power plant operation
Author 
Kiameh, Philip.
Preferred Shelf Number 
ONLINE
Electronic Access 
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7. 
Cover image for Fluid Flow, Heat Transfer and Boiling in Micro-Channels
Fluid Flow, Heat Transfer and Boiling in Micro-Channels
Author 
Yarin, L.P. author. Mosyak, A. author. Hetsroni, G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-78755-6
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