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1. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
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2. 
Cover image for Advanced signal integrity for high-speed digital designs
Advanced signal integrity for high-speed digital designs
Author 
Hall, Stephen H. Heck, Howard L.
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5361024
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3. 
Cover image for Electrostatic discharge understand, simulate and fix ESD problems
Electrostatic discharge understand, simulate and fix ESD problems
Author 
Mardiguian, Michel.
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5361037
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4. 
Cover image for Reliability wearout mechanisms in advanced CMOS technologies
Reliability wearout mechanisms in advanced CMOS technologies
Author 
Strong, Alvin Wayne, 1946-
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5361029
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5. 
Cover image for Design of cost-efficient interconnect processing units Spidergon STNoC
Design of cost-efficient interconnect processing units Spidergon STNoC
Author 
Coppola, Marcello.
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6. 
Cover image for Defects in microelectronic materials and devices
Defects in microelectronic materials and devices
Author 
Fleetwood, Daniel. Pantelides, Sokrates T. Schrimpf, Ronald Donald.
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ONLINE
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