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1. 
Cover image for Colour and the optical properties of materials an exploration of the relationship between light, the optical properties of materials and colour
Colour and the optical properties of materials an exploration of the relationship between light, the optical properties of materials and colour
Author 
Tilley, R. J. D. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=699395
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2. 
Cover image for Dynamical properties of solids
Dynamical properties of solids
Author 
Horton, George K., ed. Maradudin, A. A., ed.
Preferred Shelf Number 
QC 176.8.L3 D993 1974- V.1
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3. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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4. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-1638-9
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5. 
Cover image for Scanning Transmission Electron Microscopy Imaging and Analysis
Scanning Transmission Electron Microscopy Imaging and Analysis
Author 
Pennycook, Stephen J. editor. Nellist, Peter D. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7200-2
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6. 
Cover image for Impact of Nonlinearities on Fiber Optic Communications
Impact of Nonlinearities on Fiber Optic Communications
Author 
Kumar, Shiva. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8139-4
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7. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8164-6
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8. 
Cover image for Characterization of Terahertz Emission from High Resistivity Fe-doped Bulk Ga0.69In0.31As Based Photoconducting Antennas
Characterization of Terahertz Emission from High Resistivity Fe-doped Bulk Ga0.69In0.31As Based Photoconducting Antennas
Author 
Sengupta, Suranjana. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8198-1
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9. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9377-9
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10. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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11. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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12. 
Cover image for Silicon Photonics II Components and Integration
Silicon Photonics II Components and Integration
Author 
Lockwood, David J. editor. Pavesi, Lorenzo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-10506-7
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