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1. 
Cover image for Inside Solid State Drives (SSDs)
Inside Solid State Drives (SSDs)
Author 
Micheloni, Rino. author. Marelli, Alessia. author. Eshghi, Kam. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(335898.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-5146-0
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2. 
Cover image for High Mobility and Quantum Well Transistors Design and TCAD Simulation
High Mobility and Quantum Well Transistors Design and TCAD Simulation
Author 
Hellings, Geert. author. De Meyer, Kristin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336218.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-6340-1
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3. 
Cover image for Variation-Aware Adaptive Voltage Scaling for Digital CMOS Circuits
Variation-Aware Adaptive Voltage Scaling for Digital CMOS Circuits
Author 
Wirnshofer, Martin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336184.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-6196-4
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4. 
Cover image for Delta-Sigma A/D-Converters Practical Design for Communication Systems
Delta-Sigma A/D-Converters Practical Design for Communication Systems
Author 
Gaggl, Richard. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333863.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34543-2
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5. 
Cover image for MEMS-based Circuits and Systems for Wireless Communication
MEMS-based Circuits and Systems for Wireless Communication
Author 
Enz, Christian C. editor. Kaiser, Andreas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330847.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8798-3
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6. 
Cover image for Model-Based Design of Adaptive Embedded Systems
Model-Based Design of Adaptive Embedded Systems
Author 
Basten, Twan. editor. Hamberg, Roelof. editor. Reckers, Frans. editor. Verriet, Jacques. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331594.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4821-1
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7. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
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http://dx.doi.org/10.1007/978-1-4614-5508-0
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8. 
Cover image for Situation Awareness with Systems of Systems
Situation Awareness with Systems of Systems
Author 
van de Laar, Piërre. editor. Tretmans, Jan. editor. Borth, Michael. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331979.1)
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http://dx.doi.org/10.1007/978-1-4614-6230-9
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9. 
Cover image for Electrothermal Frequency References in Standard CMOS
Electrothermal Frequency References in Standard CMOS
Author 
Kashmiri, S. Mahdi. author. Makinwa, Kofi A. A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332040.1)
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http://dx.doi.org/10.1007/978-1-4614-6473-0
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10. 
Cover image for Ultra Low Power Transceiver for Wireless Body Area Networks
Ultra Low Power Transceiver for Wireless Body Area Networks
Author 
Masuch, Jens. author. Delgado-Restituto, Manuel. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332676.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00098-5
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11. 
Cover image for Current-Mode Analog Nonlinear Function Synthesizer Structures
Current-Mode Analog Nonlinear Function Synthesizer Structures
Author 
Popa, Cosmin Radu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332835.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-01035-9
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12. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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