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1. 
Cover image for Werkstoffe Unsichtbar, aber unverzichtbar
Werkstoffe Unsichtbar, aber unverzichtbar
Author 
Weitze, Marc-Denis. author. Berger, Christina. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336961.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-29541-6
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2. 
Cover image for Fabrication of Complex Optical Components From Mold Design to Product
Fabrication of Complex Optical Components From Mold Design to Product
Author 
Brinksmeier, Ekkard. editor. Riemer, Oltmann. editor. Gläbe, Ralf M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333648.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-33001-8
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3. 
Cover image for Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Author 
Laurila, Tomi. author. Vuorinen, Vesa. author. Paulasto-Kröckel, Mervi. author. Turunen, Markus. author. Mattila, Toni T. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-2470-2
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4. 
Cover image for GaN and ZnO-based Materials and Devices
GaN and ZnO-based Materials and Devices
Author 
Pearton, Stephen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-23521-4
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5. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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6. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0784-4
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7. 
Cover image for Device Physics of Narrow Gap Semiconductors
Device Physics of Narrow Gap Semiconductors
Author 
Chu, Junhao. author. Sher, Arden. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-1040-0
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8. 
Cover image for Nanoscience and Engineering in Superconductivity
Nanoscience and Engineering in Superconductivity
Author 
Moshchalkov, Victor. editor. Woerdenweber, Roger. editor. Lang, Wolfgang. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-15137-8
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9. 
Cover image for Toward Functional Nanomaterials
Toward Functional Nanomaterials
Author 
Wang, Zhiming M. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-77717-7
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10. 
Cover image for Solid State Theory An Introduction
Solid State Theory An Introduction
Author 
Rössler, Ulrich. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-92762-4
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11. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-85695-7
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12. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-76534-1
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