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2002
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1. 
Cover image for Process Technology for Silicon Carbide Devices
Process Technology for Silicon Carbide Devices
Author 
Zetterling, Carl-Mikael, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP002E
Format: 
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Online Library~1
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2. 
Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author 
Iyer, S. S., ed. Auberton-Herv�, A. J., e
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP001E
Format: 
Availability 
Online Library~1
Available:
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