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1. 
Cover image for Hybrid Micro-Machining Processes
Hybrid Micro-Machining Processes
Author 
Bhowmik, Sumit. author. Zindani, Divya. author. (orcid)0000-0002-9941-593X SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-13039-8
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2. 
Cover image for Self-Powered and Soft Polymer MEMS/NEMS Devices
Self-Powered and Soft Polymer MEMS/NEMS Devices
Author 
Kottapalli, Ajay Giri Prakash. author. Tao, Kai. author. Sengupta, Debarun. author. Triantafyllou, Michael S. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-05554-7
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3. 
Cover image for Analytical Modelling of Breakdown Effect in Graphene Nanoribbon Field Effect Transistor
Analytical Modelling of Breakdown Effect in Graphene Nanoribbon Field Effect Transistor
Author 
Amiri, Iraj Sadegh. author. Ghadiry, Mahdiar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6550-7
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4. 
Cover image for Femtosecond Laser 3D Micromachining for Microfluidic and Optofluidic Applications
Femtosecond Laser 3D Micromachining for Microfluidic and Optofluidic Applications
Author 
Sugioka, Koji. author. Cheng, Ya. author. (orcid)0000-0001-8269-5907 SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4471-5541-6
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5. 
Cover image for Gigaseal Formation in Patch Clamping With Applications of Nanotechnology
Gigaseal Formation in Patch Clamping With Applications of Nanotechnology
Author 
Malboubi, Majid. author. Jiang, Kyle. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-39128-6
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6. 
Cover image for Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
Author 
Samukawa, Seiji. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54795-2
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7. 
Cover image for Composites with Micro- and Nano-Structure Computational Modeling and Experiments
Composites with Micro- and Nano-Structure Computational Modeling and Experiments
Author 
Kompiš, Vladimir. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6975-8
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