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1. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-27512-8
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2. 
Cover image for Modeling of Magnetoelectric Effects in Composites
Modeling of Magnetoelectric Effects in Composites
Author 
Bichurin, Mirza. author. Petrov, Vladimir. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-94-017-9156-4
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3. 
Cover image for POWER/HVMOS Devices Compact Modeling
POWER/HVMOS Devices Compact Modeling
Author 
Grabinski, Wladyslaw. editor. Gneiting, Thomas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-3046-7
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4. 
Cover image for Photonic Crystals Physics and Practical Modeling
Photonic Crystals Physics and Practical Modeling
Author 
Sukhoivanov, Igor A. author. Guryev, Igor V. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-02646-1
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5. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-13-3627-0
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6. 
Cover image for Nanoscale Transistors Device Physics, Modeling and Simulation
Nanoscale Transistors Device Physics, Modeling and Simulation
Author 
Lundstrom, Mark S. author. Guo, Jing. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-28003-0
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7. 
Cover image for Modeling and Simulation for RF System Design
Modeling and Simulation for RF System Design
Author 
Frevert, Ronny. author. Haase, Joachim. author. Jancke, Roland. author. Knöchel, Uwe. author. Schwarz, Peter. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-27585-1
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8. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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9. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Author 
Iwamoto, Nancy. editor. Yuen, Matthew M.F. editor. Fan, Haibo. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1728-6
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10. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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11. 
Cover image for Evolution of Thin Film Morphology Modeling and Simulations
Evolution of Thin Film Morphology Modeling and Simulations
Author 
Pelliccione, Matthew. author. Lu, Toh-Ming. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-75109-2
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12. 
Cover image for Transaction Level Modeling with SystemC TLM Concepts and Applications for Embedded Systems
Transaction Level Modeling with SystemC TLM Concepts and Applications for Embedded Systems
Author 
Ghenassia, Frank. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137175
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