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1. 
Cover image for MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
Author 
Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47318-5
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Cover image for Graphene Nanoelectronics From Materials to Circuits
Graphene Nanoelectronics From Materials to Circuits
Author 
Murali, Raghu. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0548-1
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Cover image for Quaternary Capped In(Ga)As/GaAs Quantum Dot Infrared Photodetectors From Materials to Devices
Quaternary Capped In(Ga)As/GaAs Quantum Dot Infrared Photodetectors From Materials to Devices
Author 
Adhikary, Sourav. author. Chakrabarti, Subhananda. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-5290-3
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Cover image for Device Architecture and Materials for Organic Light-Emitting Devices Targeting High Current Densities and Control of the Triplet Concentration
Device Architecture and Materials for Organic Light-Emitting Devices Targeting High Current Densities and Control of the Triplet Concentration
Author 
Schols, Sarah. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1608-7
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5. 
Cover image for Tuneable Film Bulk Acoustic Wave Resonators
Tuneable Film Bulk Acoustic Wave Resonators
Author 
Gevorgian, Spartak Sh. author. Tagantsev, Alexander K. author. Vorobiev, Andrei K. author. SpringerLink (Online service)
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ONLINE(331105.1)
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http://dx.doi.org/10.1007/978-1-4471-4944-6
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6. 
Cover image for Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Author 
Meneghesso, Gaudenzio. editor. Meneghini, Matteo. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77994-2
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7. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8884-1
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8. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-58175-0
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9. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE(330808.1)
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http://dx.doi.org/10.1007/978-1-4419-5768-9
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10. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
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ONLINE(331314.1)
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http://dx.doi.org/10.1007/978-1-4614-3067-4
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11. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
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http://dx.doi.org/10.1007/978-1-4614-3160-2
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12. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
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Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
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ONLINE(331661.1)
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http://dx.doi.org/10.1007/978-1-4614-5052-8
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