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Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
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Cover image for 3D automotive modeling an insider's guide to 3D car modeling and design for games and film
3D automotive modeling an insider's guide to 3D car modeling and design for games and film
Author 
Gahan, Andrew.
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3. 
Cover image for 3D automotive modeling an insider's guide to 3D car modeling and design for games and film
3D automotive modeling an insider's guide to 3D car modeling and design for games and film
Author 
Gahan, Andrew.
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ScienceDirect http://www.sciencedirect.com/science/book/9780240814285
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4. 
Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
Author 
Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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