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49. 
Cover image for NON-LINEAR SPECTRAL UNMIXING OF HYPERSPECTRAL DATA
NON-LINEAR SPECTRAL UNMIXING OF HYPERSPECTRAL DATA
Author 
Chakravortty, Somdatta, author.
Preferred Shelf Number 
G70.4
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003432623
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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50. 
Cover image for Space terahertz remote sensing technology
Space terahertz remote sensing technology
Author 
Hu, Weidong, 1975- author. Bai, Yuming, 1989- author. Lv, Xin, author.
Preferred Shelf Number 
TK7877
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003467625
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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51. 
Cover image for Plasmonic nanosensors for biological and chemical threats
Plasmonic nanosensors for biological and chemical threats
Author 
Denizli, Adil, editor.
Preferred Shelf Number 
TP159 .C46
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003459316
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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52. 
Cover image for Human activity and behavior analysis. Volume 2, Advances in computer vision and sensors
Human activity and behavior analysis. Volume 2, Advances in computer vision and sensors
Author 
Ahad, Md. Atiqur Rahman, editor. Inoue, Sōzō, editor. Lopez, Guillaume, 1977- editor. Hossain, Tahera, editor.
Preferred Shelf Number 
TK7882 .P3
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781032636054
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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53. 
Cover image for MULTIFUNCTIONAL CEMENT-BASED SENSORS FOR INTELLIGENT CONCRETE INFRASTRUCTURE design, fabrication and application.
MULTIFUNCTIONAL CEMENT-BASED SENSORS FOR INTELLIGENT CONCRETE INFRASTRUCTURE design, fabrication and application.
Author 
Li, Wengui. Dong, Wenkui. Shah, S. P. (Surendra P.)
Preferred Shelf Number 
TK7872 .D48
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781032663685
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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54. 
Cover image for Tools for Design, Implementation and Verification of Emerging Information Technologies 17th EAI International Conference, TridentCom 2022, Melbourne, Australia, November 23-25, 2022, Proceedings
Tools for Design, Implementation and Verification of Emerging Information Technologies 17th EAI International Conference, TridentCom 2022, Melbourne, Australia, November 23-25, 2022, Proceedings
Author 
Yu, Shui. editor. Gu, Bruce. editor. Qu, Youyang. editor. Wang, Xiaodong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-33458-0
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55. 
Cover image for Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
Author 
Berta, Riccardo. editor. De Gloria, Alessandro. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-30333-3
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56. 
Cover image for Emerging Smart Technologies for Critical Infrastructure
Emerging Smart Technologies for Critical Infrastructure
Author 
Pal, Shantanu. editor. Jadidi, Zahra. editor. Foo, Ernest. editor. Mukhopadhyay, Subhas C. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29845-5
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57. 
Cover image for Proceedings of the 4th International Conference on Communication, Devices and Computing ICCDC 2023
Proceedings of the 4th International Conference on Communication, Devices and Computing ICCDC 2023
Author 
Sarkar, Dilip Kumar. editor. Sadhu, Pradip Kumar. editor. Bhunia, Sunandan. editor. Samanta, Jagannath. editor. Paul, Suman. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-2710-4
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58. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Author 
Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-26066-7
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59. 
Cover image for AI Embedded Assurance for Cyber Systems
AI Embedded Assurance for Cyber Systems
Author 
Wang, Cliff. editor. Iyengar, S.S. editor. Sun, Kun. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-42637-7
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60. 
Cover image for Experimental IR Meets Multilinguality, Multimodality, and Interaction 14th International Conference of the CLEF Association, CLEF 2023, Thessaloniki, Greece, September 18-21, 2023, Proceedings
Experimental IR Meets Multilinguality, Multimodality, and Interaction 14th International Conference of the CLEF Association, CLEF 2023, Thessaloniki, Greece, September 18-21, 2023, Proceedings
Author 
Arampatzis, Avi. editor. Kanoulas, Evangelos. editor. Tsikrika, Theodora. editor. Vrochidis, Stefanos. editor. Giachanou, Anastasia. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-42448-9
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