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Author

Jaeger, Richard C.

(5)

SpringerLink (Online service)

(5)

Wiley InterScience (Online service)

(4)

Blalock, Travis N.

(3)

Brown, William D., 1943-

(3)

Chen, Wai-Kai, 1936-

(3)

Brewer, Joe (Joe E.)

(2)

IEEE Circuits and Systems Society.

(2)

IEEE Solid-State Circuits Society.

(2)

Makabe, T. (Toshiaki), author.

(2)

Marcus, P. (Philippe), 1953-

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Ahsan, Tanweer, editor.

(1)

American Chemical Society. Division of Polymeric Materials: Science and Engineering.

(1)

Andreou, Andreas G.

(1)

(1)

Baker, R. Jacob, 1964-

(1)

Ballantyne, J. P.

(1)

Bhushan, Manjul. author.

(1)

Blalock, Travis N., ort. yaz.

(1)

Brand, Oliver. author.

(1)

Brewer, George Raymond, 1922-

(1)

Cheeke, J. David N., author.

(1)

Chen, Andrea., author.

(1)

Chen, Jing, 1974-

(1)

Choudhary, Vikas.

(1)

Components, Packaging & Manufacturing Technology Society.

(1)

(1)

Elst, Günter. editor.

(1)

Fleetwood, D. M. (Dan M.)

(1)

(1)

(1)

Goel, Sanket, editor.

(1)

Gutmann, Ronald J.

(1)

Guttman, Andras.

(1)

Hanke, Randolf. editor.

(1)

Heller, Michael J.

(1)

Heuberger, Albert. editor.

(1)

Hilleringmann, Ulrich. author.

(1)

Horie, Kazuyuki, 1941-

(1)

Hurst, S. L. (Stanley Leonard), author.

(1)

Iniewski, Krzysztof.

(1)

Ito, Hiroshi, ed.

(1)

Jim�enez, J. (Juan)

(1)

Jin, Yufeng., author.

(1)

John Wiley & Sons.

(1)

Karimi-Ghartemani, Masoud, author.

(1)

Kaya, İbrahim.

(1)

Ketchen, Mark B. author.

(1)

(1)

Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group.

(1)

(1)

Liu, S. (Sheng), 1963-

(1)

(1)

Liu, Yong, 1962-

(1)

(1)

(1)

Madkour, Loutfy H. (Loutfy Hamid), author.

(1)

Mayer, Michael. author.

(1)

Mittal, K. L., 1945- editor.

(1)

Mittal, Kash L., 1945- editor.

(1)

(1)

Oklobdzija, Vojin G.

(1)

Osaka, Tetsuya, 1945-

(1)

Pantelides, Sokrates T.

(1)

Pecht, Michael.

(1)

Pereira, Oswyn.

(1)

(1)

Petrovic, Z., author.

(1)

Puttlitz, Karl J.

(1)

Ramaswami, Sesh.

(1)

(1)

Rossnagel, Stephen M.

(1)

Ruska, W. Scot.

(1)

Schrimpf, Ronald Donald.

(1)

Schultze, J. W. (Joachim Walter)

(1)

Schwizer, Jürg. author.

(1)

Sedra, Adel S., author.

(1)

(1)

Smith, Kenneth C. (Kenneth Carless), author.

(1)

Stalter, Kathleen A.

(1)

Steigerwald, Joseph M.

(1)

Strong, Alvin Wayne, 1946-

(1)

Suganuma, Katsuaki, editor.

(1)

Sánchez-Sinencio, Edgar.

(1)

Tagawa, Seichi, ed.

(1)

Taylor and Francis.

(1)

(1)

Voyiadjis, George Z. editor.

(1)

Wang, Zhiping, 1962- Oct. 6-

(1)

Waynant, Ronald W.

(1)

(1)

(1)

Yang, Edward S.

(1)

Özerdem, Mehmet Siraç, çeviri editörü

(1)

Language

(48)

(2)

Publication Date

-

(8)

(4)

(4)

(3)

(3)

(3)

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

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(1)

Subject

Microelectronic packaging.

(11)

Electronic books.

(9)

Integrated circuits -- Design and construction.

(6)

Semiconductors -- Design and construction.

(5)

Electronic circuits.

(4)

Microelectronics.

(4)

Nanotechnology.

(4)

Electronic circuit design.

(3)

(3)

Microelectronics -- Materials.

(3)

Mikroelektronik.

(3)

Chemical mechanical planarization.

(2)

Corrosion and anti-corrosives.

(2)

Electronic packaging.

(2)

Low voltage integrated circuits.

(2)

Microelectromechanical systems.

(2)

MİKROELEKTRONİK.

(2)

Optical materials.

(2)

Optoelectronic devices.

(2)

Plasma engineering.

(2)

Systems engineering.

(2)

İNTEGRE DEVRELER -- ÇİZİM VE YAPIM.

(2)

Adhesion -- Congresses.

(1)

(1)

Adhesive joints.

(1)

(1)

Appareil électronique.

(1)

(1)

Building materials.

(1)

CMOS (Circuit intégré)

(1)

CMOS-Schaltung.

(1)

Carbon composites -- Industrial applications.

(1)

Carbon composites.

(1)

Ceramic materials.

(1)

(1)

(1)

Chip scale packaging.

(1)

Circuit intégré à faible consommation.

(1)

Circuit intégré à très grande échelle.

(1)

Circuit logique.

(1)

Circuit électronique.

(1)

Classical Mechanics.

(1)

Coatings -- Congresses.

(1)

(1)

Computer network architectures.

(1)

Computer science.

(1)

DNA microarrays.

(1)

Dispositif optoélectronique.

(1)

Electric connectors.

(1)

Electric filters.

(1)

Electric power systems -- Equipment and supplies.

(1)

Electrical engineering -- Computer-aided design.

(1)

Electronic Circuits and Systems.

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic apparatus and appliances.

(1)

Electronics and Microelectronics, Instrumentation.

(1)

Elektronenstrahllithographie.

(1)

Elektronik devreler.

(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

(1)

Environmental protection.

(1)

(1)

Flash memories (Computers)

(1)

Frequency synthesizers.

(1)

Green products.

(1)

Grinding and polishing.

(1)

High performance processors -- Design and construction.

(1)

High power lasers.

(1)

ISI -- İLETİM.

(1)

Integrated circuits -- Defects.

(1)

Integrated circuits -- Very large scale integration -- Computer-aided design.

(1)

Integrated circuits -- Very large scale integration -- Design and construction -- Textbooks.

(1)

Integrated circuits -- Very large scale integration.

(1)

Integrated circuits industry.

(1)

Lithography, Electron beam.

(1)

Logic circuits.

(1)

MIKROELEKTRONIK.

(1)

Mechanics, Applied.

(1)

(1)

Metal oxide semiconductor field-effect transistors -- Testing.

(1)

Metal oxide semiconductor field-effect transistors.

(1)

Metal oxide semiconductors, Complementary -- Design and construction.

(1)

Metal oxide semiconductors, Complementary -- Reliability.

(1)

Metal oxide semiconductors, Complementary.

(1)

Microelectronic packaging -- Materials.

(1)

Microelectronic packaging -- Simulation methods.

(1)

Microelectronic.

(1)

Microelectronics -- Materials -- Congresses.

(1)

Microelectronics -- Materials -- Testing.

(1)

Microprogramming.

(1)

Mikroelektronik -- Maddele -- Kongreler.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Multichip modules (Microelectronics)

(1)

Mémoire à semiconducteurs.

(1)

Nanobiotechnology -- Materials.

(1)

Nanocomposites (Materials)

(1)

Nanocomposites (Materials) -- Industrial applications.

(1)

Nanoelectronics.

(1)

(1)

Nanostructured materials.

(1)

Passive components.

(1)

Phase-locked loops.

(1)

Photoluminescence.

(1)

(1)

Polymers -- Congresses.

(1)

Power electronics.

(1)

Printed circuits -- Equipment and supplies.

(1)

(1)

SCIENCE / Applied Sciences

(1)

SCIENCE / Chemistry / Clinical

(1)

Schaltungsentwurf.

(1)

Semiconductor lasers.

(1)

Semiconductor storage devices.

(1)

Semiconductors.

(1)

Signal processing.

(1)

Software engineering.

(1)

Solder and soldering.

(1)

Solid Mechanics.

(1)

(1)

Strains and stresses -- Measurement.

(1)

Structural Materials.

(1)

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Digital.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.

(1)

TECHNOLOGY & ENGINEERING / Microwaves

(1)

TECHNOLOGY / Electronics / General

(1)

TECHNOLOGY / Electronics / Microelectronics

(1)

Telecommunication -- Equipment and supplies.

(1)

Telecommunication -- Technological innovations.

(1)

Thin films -- Computer simulation -- Congresses.

(1)

Thin films -- Congresses.

(1)

(1)

Three-dimensional integrated circuits -- Computer-aided design.

(1)

Three-dimensional integrated circuits -- Design and construction.

(1)

Three-dimensional integrated circuits -- Testing.

(1)

Three-dimensional integrated circuits.

(1)

Timing circuits.

(1)

Ultrasonic waves -- Industrial applications.

(1)

Ultrasonic waves.

(1)

Very high speed integrated circuits.

(1)

Wide gap semiconductors.

(1)

YARIİLETKENLER -- ÇİZİM VE YAPIM.

(1)

YARIİLETKENLER.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Taylor Francis E-Book Collection

Library

Beytepe Library

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37.

Cover image for Nonvolatile semiconductor memory technology a comprehensive guide to understanding and to using NVSM devices

Nonvolatile semiconductor memory technology a comprehensive guide to understanding and to using NVSM devices

Nonvolatile semiconductor memory technology a comprehensive guide to understanding and to using NVSM devices

Author

Brown, William D., 1943- Brewer, Joe (Joe E.)

Preferred Shelf Number

ONLINE

Electronic Access

IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263122

Format:

Availability

Online Library~1

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38.

Cover image for Mikroelektroniğin temelleri

Mikroelektroniğin temelleri

Mikroelektroniğin temelleri

Author

Razavi, Behzad Özerdem, Mehmet Siraç, çeviri editörü Kaya, İbrahim.

Preferred Shelf Number

TK7874 R3919 2018

Format:

Availability

Beytepe Library~1

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Copies:

39.

Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability

Author

Suganuma, Katsuaki, editor.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect https://www.sciencedirect.com/science/book/9780081020944

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40.

Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Author

Voyiadjis, George Z. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-1-4614-5589-9

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41.

Cover image for Adhesion in microelectronics

Adhesion in microelectronics

Adhesion in microelectronics

Author

Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.

Preferred Shelf Number

ONLINE(341844.1)

Electronic Access

ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373

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42.

Cover image for Adhesion measurement of films and coatings. Volume 2

Adhesion measurement of films and coatings. Volume 2

Adhesion measurement of films and coatings. Volume 2

Author

Mittal, Kash L., 1945- editor. Taylor and Francis.

Preferred Shelf Number

QC183

Electronic Access

Click here to view.

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43.

Cover image for MEMS : fundamental technology and applications

MEMS : fundamental technology and applications

MEMS : fundamental technology and applications

Author

Choudhary, Vikas. Iniewski, Krzysztof.

Preferred Shelf Number

TK7875 .M457 2013

Electronic Access

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Format:

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44.

Cover image for Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Author

Marcus, P. (Philippe), 1953-

Preferred Shelf Number

TA462 .C65575 2012

Electronic Access

Click here to view.

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45.

Cover image for Semiconductor packaging : materials interaction and reliability

Semiconductor packaging : materials interaction and reliability

Semiconductor packaging : materials interaction and reliability

Author

Chen, Andrea., author. Lo, Randy.

Preferred Shelf Number

TK7870.15 .C54 2012

Electronic Access

Click here to view.

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46.

Cover image for Fundamentals and applications of ultrasonic waves

Fundamentals and applications of ultrasonic waves

Fundamentals and applications of ultrasonic waves

Author

Cheeke, J. David N., author.

Preferred Shelf Number

QC244 .C47 2012

Electronic Access

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47.

Cover image for 3D IC stacking technology

3D IC stacking technology

3D IC stacking technology

Author

Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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48.

Cover image for Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Author

Tomm, Jens W. Jim�enez, J. (Juan)

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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