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13. 
Cover image for Smart Power Systems and Renewable Energy System Integration
Smart Power Systems and Renewable Energy System Integration
Author 
Jayaweera, Dilan. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-30427-4
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14. 
Cover image for Advanced Hybrid and Electric Vehicles System Optimization and Vehicle Integration
Advanced Hybrid and Electric Vehicles System Optimization and Vehicle Integration
Author 
Nikowitz, Michael. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-26305-2
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15. 
Cover image for Network-on-chip : the next generation of system-on-chip integration
Network-on-chip : the next generation of system-on-chip integration
Author 
Kundu, Santanu, author. Chattopadhyay, Santanu, contributor.
Preferred Shelf Number 
TK5105.546 .K86 2015
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16. 
Cover image for Wind Power Integration Connection and System Operational Aspects
Wind Power Integration Connection and System Operational Aspects
Author 
Fox, Brendan Bryans, Leslie Flynn, Damian Jenkins, Nick Milborrow, David
Preferred Shelf Number 
\(364920.1)
Electronic Access 
http://dx.doi.org/10.1049/PBRN014E
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17. 
Cover image for System design and control integration for advanced manufacturing
System design and control integration for advanced manufacturing
Author 
Li, Han-Xiong, author. Lu, XinJiang (Manufacturing researcher), author.
Preferred Shelf Number 
ONLINE(341830.1)
Electronic Access 
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1818247
John Wiley http://dx.doi.org/10.1002/9781118822401
http://swb.eblib.com/patron/FullRecord.aspx?p=1818247
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18. 
Cover image for Driving sustainability to business success : the DS factor-management system integration and automation
Driving sustainability to business success : the DS factor-management system integration and automation
Author 
Pilot, Jayne.
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ONLINE(342062.1)
Electronic Access 
Ebook Library Click here to view book
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John Wiley http://dx.doi.org/10.1002/9781118936733
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19. 
Cover image for VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers
VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers
Author 
Burg, Andreas. editor. Coṣkun, Ayṣe. editor. Guthaus, Matthew. editor. Katkoori, Srinivas. editor. Reis, Ricardo. editor.
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ONLINE(335188.1)
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http://dx.doi.org/10.1007/978-3-642-45073-0
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20. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
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ONLINE
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IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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21. 
Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
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22. 
Cover image for Integration of distributed generation in the power system
Integration of distributed generation in the power system
Author 
Bollen, Math H. J., 1960-
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ONLINE
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IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=6047601
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23. 
Cover image for Multiprocessor System-on-Chip Hardware Design and Tool Integration
Multiprocessor System-on-Chip Hardware Design and Tool Integration
Author 
Hübner, Michael. editor. Becker, Jürgen. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6460-1
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24. 
Cover image for Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration IC Stacking Process and Design
Author 
Papanikolaou, Antonis. editor. Soudris, Dimitrios. editor. Radojcic, Riko. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-0962-6
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