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1. 
Cover image for Surfaces and interfaces of electronic materials
Surfaces and interfaces of electronic materials
Author 
Brillson, L. J.
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Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=951893
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6542360
IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=6542360
John Wiley http://dx.doi.org/10.1002/9783527665709
MyiLibrary, Table of contents http://www.myilibrary.com?id=371977&ref=toc
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2. 
Cover image for Magnetic properties of antiferromagnetic oxide materials surfaces, interfaces, and thin films
Magnetic properties of antiferromagnetic oxide materials surfaces, interfaces, and thin films
Author 
Duò, Lamberto. Finazzi, Marco. Ciccacci, Franco. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9783527630370
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3. 
Cover image for Science at the nanoscale an introductory textbook
Science at the nanoscale an introductory textbook
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Chin, Wee Shong. Sow, Chorng Haur. Wee, Andrew T. S.
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4. 
Cover image for Geotechnical slope analysis
Geotechnical slope analysis
Author 
Chowdhury, Robin. Flentje, Phil. Bhattacharya, Gautam.
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5. 
Cover image for Conjugate problems in convective heat transfer
Conjugate problems in convective heat transfer
Author 
Dorfman, A. Sh. (Abram Shlemovich)
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6. 
Cover image for Computational Methods for Sensor Material Selection
Computational Methods for Sensor Material Selection
Author 
Ryan, Margaret A. editor. Shevade, Abhijit V. editor. Taylor, Charles J. editor. Homer, M. L. editor. Blanco, Mario. editor.
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http://dx.doi.org/10.1007/978-0-387-73715-7
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7. 
Cover image for Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Author 
Wallenberger, Frederick T. editor. Bingham, Paul A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0736-3
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8. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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9. 
Cover image for The Physics of Solids Essentials and Beyond
The Physics of Solids Essentials and Beyond
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Economou, Eleftherios N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02069-8
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10. 
Cover image for Laser-Surface Interactions for New Materials Production Tailoring Structure and Properties
Laser-Surface Interactions for New Materials Production Tailoring Structure and Properties
Author 
Miotello, Antonio. editor. Ossi, Paolo M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-03307-0
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11. 
Cover image for High-Tc Superconductors Based on FeAs Compounds
High-Tc Superconductors Based on FeAs Compounds
Author 
Izyumov, Yuri. author. Kurmaev, Ernst. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-14530-8
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12. 
Cover image for Device Physics of Narrow Gap Semiconductors
Device Physics of Narrow Gap Semiconductors
Author 
Chu, Junhao. author. Sher, Arden. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1040-0
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