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1. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
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ONLINE
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2. 
Cover image for Food and beverage packaging technology
Food and beverage packaging technology
Author 
Kirwan, Mark J.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781444392180
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=675208
ebrary http://site.ebrary.com/id/10510323
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3. 
Cover image for Aseptic processing and packaging of food products
Aseptic processing and packaging of food products
Author 
Holdworth, S. D.
Preferred Shelf Number 
TP 371.2 H65 1992
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Beytepe Library~1
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4. 
Cover image for Solar module packaging polymeric requirements and selection
Solar module packaging polymeric requirements and selection
Author 
Poliskie, Michelle.
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5. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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6. 
Cover image for Quantum-well laser array packaging nanoscale packaging techniques
Quantum-well laser array packaging nanoscale packaging techniques
Author 
Tomm, Jens W. Jim�enez, J. (Juan)
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ONLINE
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7. 
Cover image for Modified atmosphere packaging for fresh-cut fruits and vegetables
Modified atmosphere packaging for fresh-cut fruits and vegetables
Author 
Brody, Aaron L. Zhuang, Hong. Han, Jung H. Wiley InterScience (Online service)
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ONLINE
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Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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8. 
Cover image for Formulating, packaging, and marketing of natural cosmetic products
Formulating, packaging, and marketing of natural cosmetic products
Author 
Dayan, Nava. Kromidas, Lambros. Wiley InterScience (Online service)
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ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
MyiLibrary, Table of contents http://www.myilibrary.com?id=317588&ref=toc
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9. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
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ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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10. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
Preferred Shelf Number 
ONLINE
Electronic Access 
Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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11. 
Cover image for Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Author 
Edwards, Bronwen.
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ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=571401
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12. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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