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1. 
Cover image for VLSI electronics microstructure science
VLSI electronics microstructure science
Author 
Einspruch, Norman G.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780122341236
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2. 
Cover image for Parallel distributed processing : explorations in the microstructure of cognition
Parallel distributed processing : explorations in the microstructure of cognition
Author 
Rumelhart, David E. McClelland, James L., ort. yaz. University of California, San Diego. PDP Research Group.
Preferred Shelf Number 
BF 455 R853 1986 V.1
Format: 
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Beytepe Library~2
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3. 
Cover image for Silicon molecular beam epitaxy proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
Silicon molecular beam epitaxy proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
Author 
International Symposium on Silicon Molecular Beam Epitaxy (3rd : 1989 : Strasbourg, France) Kasper, Erich. Parker, E. H. C. European Materials Research Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444886200
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4. 
Cover image for Bioscience methodologies in physical chemistry : an engineering and molecular approach
Bioscience methodologies in physical chemistry : an engineering and molecular approach
Author 
D'Amore, Alberto, editor. Zaikov, Gennady E., editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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5. 
Cover image for Micro- and macromechanical properties of materials
Micro- and macromechanical properties of materials
Author 
Zhou, Yichun, 1963-
Preferred Shelf Number 
ONLINE(342878.1)
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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6. 
Cover image for In-situ Studies with Photons, Neutrons and Electrons Scattering II
In-situ Studies with Photons, Neutrons and Electrons Scattering II
Author 
Kannengiesser, Thomas. editor. Babu, Sudarsanam Suresh. editor. Komizo, Yu-ichi. editor. Ramirez, Antonio J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06145-0
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7. 
Cover image for Structures and Interactions of Ionic Liquids
Structures and Interactions of Ionic Liquids
Author 
Zhang, Suojiang. editor. Wang, Jianji. editor. Lu, Xingmei. editor. Zhou, Qing. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-38619-0
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8. 
Cover image for Gelled Bicontinuous Microemulsions A New Type of Orthogonal Self-Assembled Systems
Gelled Bicontinuous Microemulsions A New Type of Orthogonal Self-Assembled Systems
Author 
Laupheimer, Michaela. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-07719-2
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9. 
Cover image for Numerical Modeling of Materials Under Extreme Conditions
Numerical Modeling of Materials Under Extreme Conditions
Author 
Bonora, Nicola. editor. Brown, Eric. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-54258-9
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10. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9176-7
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11. 
Cover image for Proceedings of the 11th European Conference on Thermoelectrics ECT 2013
Proceedings of the 11th European Conference on Thermoelectrics ECT 2013
Author 
Amaldi, Andrea. editor. Tang, Francois. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-07332-3
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