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Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-93627-3
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2. 
Cover image for Artificial Intelligence and Hardware Accelerators
Artificial Intelligence and Hardware Accelerators
Author 
Mishra, Ashutosh. editor. Cha, Jaekwang. editor. Park, Hyunbin. editor. Kim, Shiho. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22170-5
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3. 
Cover image for Embedded Systems Design using the MSP430FR2355 LaunchPad™
Embedded Systems Design using the MSP430FR2355 LaunchPad™
Author 
LaMeres, Brock J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20888-1
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4. 
Cover image for HEMT Technology and Applications
HEMT Technology and Applications
Author 
Lenka, Trupti Ranjan. editor. Nguyen, Hieu Pham Trung. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2165-0
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