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1. 
Cover image for PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
Author 
JAMNIA, ALI.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK7870.15 .J36 2009
Electronic Access 
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3. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
Preferred Shelf Number 
TK7870.15 .H3657 2004
Electronic Access 
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4. 
Cover image for Thermal and structural electronic packaging analysis for space and extreme environments
Thermal and structural electronic packaging analysis for space and extreme environments
Author 
Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
Preferred Shelf Number 
ONLINE
Electronic Access 
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6. 
Cover image for Flexible electronic packaging and encapsulation technology
Flexible electronic packaging and encapsulation technology
Author 
Meng, Hong, editor. Huang, Wei, editor.
Preferred Shelf Number 
TK7870.15 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729
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7. 
Cover image for Lead-free soldering in electronics : science, technology and environmental impact
Lead-free soldering in electronics : science, technology and environmental impact
Author 
Suganuma, Katsuaki.
Preferred Shelf Number 
TK7870.15 .L43 2004
Electronic Access 
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8. 
Cover image for Run-to-run control in semiconductor manufacturing
Run-to-run control in semiconductor manufacturing
Author 
Del Castillo, Enrique. Hurwitz, Arnon Max. Moyne, James.
Preferred Shelf Number 
TK7871.85 .R863 2001
Electronic Access 
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