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1. 
Cover image for Micro and Smart Devices and Systems
Micro and Smart Devices and Systems
Author 
Vinoy, K. J. editor. Ananthasuresh, G. K. editor. Pratap, Rudra. editor. Krupanidhi, S. B. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-1913-2
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2. 
Cover image for Micro and Nanomanufacturing Volume II
Micro and Nanomanufacturing Volume II
Author 
Jackson, Mark J. editor. Ahmed, Waqar. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-67132-1
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3. 
Cover image for FPGA Based Accelerators for Financial Applications
FPGA Based Accelerators for Financial Applications
Author 
De Schryver, Christian. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-15407-7
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4. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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5. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
Author 
Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06764-3
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6. 
Cover image for Piezoelectric Accelerometers with Integral Electronics
Piezoelectric Accelerometers with Integral Electronics
Author 
Levinzon, Felix. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08078-9
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7. 
Cover image for Electrodeposition and Surface Finishing Fundamentals and Applications
Electrodeposition and Surface Finishing Fundamentals and Applications
Author 
Djokić, Stojan S. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-0289-7
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8. 
Cover image for Atomic Layer Deposition for Semiconductors
Atomic Layer Deposition for Semiconductors
Author 
Hwang, Cheol Seong. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4614-8054-9
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9. 
Cover image for Grundprinzipien der Mechatronik Modellbildung und Simulation mit Bondgraphen
Grundprinzipien der Mechatronik Modellbildung und Simulation mit Bondgraphen
Author 
Roddeck, Werner. author. SpringerLink (Online service)
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ONLINE(338334.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-8348-2194-2
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10. 
Cover image for Einführung in die Mechatronik
Einführung in die Mechatronik
Author 
Roddeck, Werner. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-8348-8626-2
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11. 
Cover image for Machining with Abrasives
Machining with Abrasives
Author 
Jackson, Mark J. editor. Davim, J. Paulo. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7302-3
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12. 
Cover image for Electromechanical Systems in Microtechnology and Mechatronics Electrical, Mechanical and Acoustic Networks, their Interactions and Applications
Electromechanical Systems in Microtechnology and Mechatronics Electrical, Mechanical and Acoustic Networks, their Interactions and Applications
Author 
Lenk, Arno. author. Ballas, Rüdiger G. author. Werthschützky, Roland. author. Pfeifer, Günther. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-10806-8
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