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1. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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2. 
Cover image for Planewaves, Pseudopotentials and the LAPW Method
Planewaves, Pseudopotentials and the LAPW Method
Author 
Singh, David J. author. Nordström, Lars. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-29684-5
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3. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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4. 
Cover image for Introduction to Focused Ion Beams Instrumentation, Theory, Techniques and Practice
Introduction to Focused Ion Beams Instrumentation, Theory, Techniques and Practice
Author 
Giannuzzi, Lucille A. editor. Stevie, Fred A. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101190
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5. 
Cover image for Thin Films and Heterostructures for Oxide Electronics
Thin Films and Heterostructures for Oxide Electronics
Author 
Ogale, Satischandra B. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b136780
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