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1. 
Cover image for Integrated Electronic Circuits
Integrated Electronic Circuits
Author 
Atallah, Jad G. author. Ismail, Mohammed. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-62707-1
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2. 
Cover image for Counterfeit Integrated Circuits Detection and Avoidance
Counterfeit Integrated Circuits Detection and Avoidance
Author 
Tehranipoor, Mark (Mohammad). author. Guin, Ujjwal. author. Forte, Domenic. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-11824-6
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3. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5508-0
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4. 
Cover image for Testing of Interposer-Based 2.5D Integrated Circuits
Testing of Interposer-Based 2.5D Integrated Circuits
Author 
Wang, Ran. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-54714-5
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5. 
Cover image for Hardware Security and Trust Design and Deployment of Integrated Circuits in a Threatened Environment
Hardware Security and Trust Design and Deployment of Integrated Circuits in a Threatened Environment
Author 
Sklavos, Nicolas. editor. Chaves, Ricardo. editor. Di Natale, Giorgio. editor. Regazzoni, Francesco. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44318-8
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6. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-07611-9
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7. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9542-1
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8. 
Cover image for Fundamentals of Electromigration-Aware Integrated Circuit Design
Fundamentals of Electromigration-Aware Integrated Circuit Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Rothe, Susann. author. Thiele, Matthias. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-80023-8
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9. 
Cover image for Bio/CMOS Interfaces and Co-Design
Bio/CMOS Interfaces and Co-Design
Author 
Carrara, Sandro. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-31832-0
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10. 
Cover image for From Variability Tolerance to Approximate Computing in Parallel Integrated Architectures and Accelerators
From Variability Tolerance to Approximate Computing in Parallel Integrated Architectures and Accelerators
Author 
Rahimi, Abbas. author. Benini, Luca. author. Gupta, Rajesh K. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-53768-9
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11. 
Cover image for Hardware Protection through Obfuscation
Hardware Protection through Obfuscation
Author 
Forte, Domenic. editor. Bhunia, Swarup. editor. Tehranipoor, Mark M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-49019-9
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12. 
Cover image for Carbon Nanotubes for Interconnects Process, Design and Applications
Carbon Nanotubes for Interconnects Process, Design and Applications
Author 
Todri-Sanial, Aida. editor. Dijon, Jean. editor. Maffucci, Antonio. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-29746-0
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