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1. 
Cover image for Smart Systems Integration and Simulation
Smart Systems Integration and Simulation
Author 
Bombieri, Nicola. editor. Poncino, Massimo. editor. Pravadelli, Graziano. editor. (orcid)0000-0002-7833-1673 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-27392-1
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2. 
Cover image for Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
Author 
Hu, Kai. author. Chakrabarty, Krishnendu. author. Ho, Tsung-Yi. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-56255-1
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3. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-52548-8
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4. 
Cover image for Neuromorphic Computing Principles and Organization
Neuromorphic Computing Principles and Organization
Author 
Ben Abdallah, Abderazek. author. Dang, Khanh N. author. (orcid)0000-0001-6702-3870 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-83089-1
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5. 
Cover image for Bio/CMOS Interfaces and Co-Design
Bio/CMOS Interfaces and Co-Design
Author 
Carrara, Sandro. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-31832-0
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6. 
Cover image for Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Author 
Aly, Mohamed M. Sabry. editor. Chattopadhyay, Anupam. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-16-7487-7
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7. 
Cover image for Carbon Nanotubes for Interconnects Process, Design and Applications
Carbon Nanotubes for Interconnects Process, Design and Applications
Author 
Todri-Sanial, Aida. editor. Dijon, Jean. editor. Maffucci, Antonio. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29746-0
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8. 
Cover image for Designing with Xilinx® FPGAs Using Vivado
Designing with Xilinx® FPGAs Using Vivado
Author 
Churiwala, Sanjay. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-42438-5
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9. 
Cover image for Hardware Protection through Obfuscation
Hardware Protection through Obfuscation
Author 
Forte, Domenic. editor. Bhunia, Swarup. editor. Tehranipoor, Mark M. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-49019-9
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10. 
Cover image for Distributed Simulation A Model Driven Engineering Approach
Distributed Simulation A Model Driven Engineering Approach
Author 
Topçu, Okan. author. Durak, Umut. author. Oğuztüzün, Halit. author. Yilmaz, Levent. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-03050-0
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11. 
Cover image for 3D Stacked Chips From Emerging Processes to Heterogeneous Systems
3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Author 
Elfadel, Ibrahim (Abe) M. editor. (orcid)0000-0003-3220-9987 Fettweis, Gerhard. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-20481-9
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12. 
Cover image for Three-Dimensional Design Methodologies for Tree-based FPGA Architecture
Three-Dimensional Design Methodologies for Tree-based FPGA Architecture
Author 
Pangracious, Vinod. author. Marrakchi, Zied. author. Mehrez, Habib. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-19174-4
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