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Publication Date: 2002

Author

(1)

(1)

Auberton-Herv�, A. J., e

(1)

Beckley, Philip

(1)

(1)

(1)

Iyer, S. S., ed.

(1)

Regnault, John, ed.

(1)

Sun, Yichuang, ed.

(1)

Temple, Robert, ed.

(1)

Tokhi, Osman, ed.

(1)

Veres, Sandor, ed.

(1)

Zetterling, Carl-Mikael, ed.

(1)

Language

(10)

Subject

Micromechanics.

(2)

Microprocessors.

(2)

(2)

(2)

Active noise and vibration control.

(1)

Adaptive filters.

(1)

Artificial intelligence--Engineering applications.

(1)

Biometric identification.

(1)

(1)

(1)

Coaxial cables.

(1)

Computer networks--Access control.

(1)

Computer networks--Security measures.

(1)

Control theory.

(1)

(1)

Cost estimates.

(1)

(1)

(1)

Digital computer simulation.

(1)

Diodes, Schottky-barrier.

(1)

Electric circuits.

(1)

Electric filters, Active.

(1)

Electric filters.

(1)

Electric insulators and insulation.

(1)

Electric relays.

(1)

Electric resistance.

(1)

Electron tubes--Thermionic emission.

(1)

Electronic apparatus and appliances.

(1)

Electronic circuits.

(1)

(1)

(1)

Finite element method.

(1)

Grinding and polishing.

(1)

Heat treatment.

(1)

Human-computer interaction.

(1)

Information retrieval.

(1)

Integrated circuits--Very large scale integration.

(1)

(1)

Ion implantation.

(1)

Low voltage integrated circuits.

(1)

Manufacturing processes.

(1)

Metal oxide semiconductor field-effect transistors.

(1)

Mobile computing.

(1)

(1)

Ohmic contacts.

(1)

Operational amplifiers.

(1)

Optical fiber communication.

(1)

Power semiconductors.

(1)

Programming languages (Electronic computers).

(1)

Public key cryptography.

(1)

Pulse-code modulation.

(1)

Punching (Metal-work).

(1)

Quality assurance--Management.

(1)

Semiconductor wafers.

(1)

Semiconductors--Junctions.

(1)

Semiconductors.

(1)

Silicon compounds.

(1)

Silicon-on-insulator technology.

(1)

(1)

(1)

(1)

Steel industry and trade.

(1)

Stepping motors.

(1)

(1)

Telecommunication equipment industry.

(1)

Telecommunication systems.

(1)

Telecommunication--Equipment and supplies.

(1)

Telecommunication--Security measures.

(1)

Telecommunication--Switching systems.

(1)

(1)

Telephone lines.

(1)

Television broadcasting.

(1)

(1)

Thickness measurement.

(1)

(1)

(1)

Virtual computer systems.

(1)

Virtual reality.

(1)

Visual communication.

(1)

Wide gap semiconductors.

(1)

Wireless communication systems.

(1)

XML (Document markup language).

(1)

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Electronic Library

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1.

Cover image for Active Sound and Vibration Control Theory and applications

Active Sound and Vibration Control Theory and applications

Active Sound and Vibration Control Theory and applications

Author

Tokhi, Osman, ed. Veres, Sandor, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBCE062E

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2.

Cover image for Stepping Motors A guide to theory and practice

Stepping Motors A guide to theory and practice

Stepping Motors A guide to theory and practice

Author

Acarnley, Paul

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBCE063E

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3.

Cover image for Intelligent Networks Principles and applications

Intelligent Networks Principles and applications

Intelligent Networks Principles and applications

Author

Anderson, John

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBTE046E

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Online Library~1

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4.

Cover image for Internet and Wireless Security

Internet and Wireless Security

Internet and Wireless Security

Author

Temple, Robert, ed. Regnault, John, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBBT004E

Format:

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Online Library~1

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5.

Cover image for Design of High Frequency Integrated Analogue Filters

Design of High Frequency Integrated Analogue Filters

Design of High Frequency Integrated Analogue Filters

Author

Sun, Yichuang, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBCS014E

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6.

Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Author

Iyer, S. S., ed. Auberton-Herv�, A. J., e

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP001E

Format:

Availability

Online Library~1

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7.

Cover image for Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Author

Zetterling, Carl-Mikael, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP002E

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8.

Cover image for Radio Man The remarkable rise and fall of C.O. Stanley

Radio Man The remarkable rise and fall of C.O. Stanley

Radio Man The remarkable rise and fall of C.O. Stanley

Author

Frankland, M.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBHT030E

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9.

Cover image for Innovation and the Communications Revolution

Innovation and the Communications Revolution

Innovation and the Communications Revolution

Author

Bray, J.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBNS030E

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10.

Cover image for Electrical Steels for Rotating Machines

Electrical Steels for Rotating Machines

Electrical Steels for Rotating Machines

Author

Beckley, Philip

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBPO037E

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